Phenolic molding compound is a variety with a large amount of phenolic resin. Because of its advantages of simple molding process, excellent product performance, and low cost, it is not only used for manufacturing electrical insulation devices, but also widely used in the fields of automobiles, aircraft parts or products. Since the industrial production of phenolic molding compounds, the research on modification of phenolic molding compounds is relatively mature.

According to the purpose of modification, there are heat resistance modification, toughening modification, wear resistance modification, moisture resistance modification, etc.; according to the modification method, there are resin matrix modification and filler modification, in which resin Matrix modification includes structural modification, blending modification and copolymerization modification. The performance of the final product is related to the performance of the raw material itself, molding process and post-processing means.

Phenolic molding compound is widely used because of its simple production process, high quality, low price and easy processing. The molding shrinkage of phenolic molding compounds depends on various factors, such as resin composition, filler type, moisture content, and molding conditions. The linear expansion coefficient of phenolic resin molding compound has a great relationship with the type of filler. With the increase of inorganic fillers such as glass fiber in the plastic, the linear expansion coefficient decreases, while the linear expansion coefficient of plastics containing synthetic fibers is larger.