1. Brief introduction of phenolic molding compound:

The phenolic molding compound uses phenolic resin as the binder, wood powder as the main filler, supplemented with additives, and is a powdered phenolic molding compound prepared by hot refining process. Suitable for compression molding and injection molding, used in low-voltage electrical appliances, ordinary household appliances, flame-retardant, heat-resistant and water-resistant high-strength electrical accessories and water-lubricated bearings and seals, high-performance automotive parts, insulating structural parts for transportation appliances and High-frequency insulating telecommunications, radio insulating parts, etc.

2. The processing characteristics of phenolic molding compound are as follows:

(1). Due to the polycondensation reaction in the curing process of phenolic molding compounds, water will be condensed out, so it must be pressurized while being heated and cured, that is, the method of compression molding or lamination must be used.

(2). During the molding process of phenolic vinegar molding compound, the mold temperature has a greater influence on its fluidity, and when it is generally exceeded, the fluidity drops rapidly. The curing rate is slow, and a lot of heat will be released, so thick-walled products tend to cause uneven curing and overheating due to the difficulty of releasing internal heat.

(3). Phenolic molding compound usually needs to be dried before molding, the drying temperature is 90 ~ 12 (Tt, the drying time is 60s.