1. Physical properties

The molding shrinkage of phenolic molding compounds depends on various factors, such as resin composition, filler type, moisture content, and molding conditions. The linear expansion coefficient of phenolic resin molding compound has a great relationship with the type of filler. With the increase of glass fiber and other inorganic fillers in the plastic, the linear expansion coefficient decreases, while the linear expansion coefficient of plastics containing synthetic fibers is larger.

2. Mechanical properties

The creep resistance of phenolic molding compounds at room temperature varies with the filler and has a different temperature dependence. The molding compounds containing inorganic fillers such as mica and asbestos have better creep resistance than those containing organic fillers. Generally speaking, the tensile strength and bending strength of the molding compound with glass fiber as the filler are better, and it is less affected by temperature, and some fillers such as wood powder are easy to absorb moisture. This will cause bending strength and bending modulus. decline.

3. Electrical performance

Phenolic resin plastic has good electrical properties, it has higher insulation performance at room temperature, such as higher volume resistance, surface resistance and breakdown voltage, can be used as an insulating material, but its dielectric constant and dielectric loss angle The tangent is large and can only be used as a power frequency insulation material.

4. Corrosion resistance

Phenolic resins without fillers are hardly attacked by inorganic acids, insoluble in most hydrocarbons and chlorides, and insoluble in ketones and intoxicants. But it is not resistant to corrosion by concentrated sulfuric acid, nitric acid, high temperature chromic acid, etc.